Cleaning is critical to yield and reliability, but cleaning what you can't see requires new approaches, materials, and equipment | Continue reading
Advanced etch holds key to nanosheet FETs; evolutionary path for future nodes. | Continue reading
From specific design team skills, to organizational and economic impacts, the move to bespoke silicon is shaking things up. | Continue reading
New memory approaches and challenges in scaling CMOS point to radical changes — and potentially huge improvements — in semiconductor designs. | Continue reading
A new technical paper titled “Advanced Embedded System Modeling and Simulation in an Open Source RISC-V Virtual Prototype” was published by researchers at DFKI GmbH and University of Bremen. Abstract... » read more | Continue reading
A new technical paper titled “On-Device Training Under 256KB Memory” was published by researchers at MIT and MIT-IBM Watson AI Lab. “Our study enables IoT devices to not only perform... » read more | Continue reading
Shortening data paths between processor and memory may help, but not always. | Continue reading
Optimal power, performance, and timing hinge on making the right decisions about the clock network architecture. | Continue reading
The ecosystem of semi-autonomous vehicles goes far beyond self-driving cars, and so do the design challenges. | Continue reading
As chip companies customize designs, the number of possible pitfalls is growing. Tighter partnerships and acquisitions may help. | Continue reading
More electronics everywhere and more connectivity create issues involving power, performance, cost, and security. | Continue reading
Good adhesion, stress management, and warpage control are features of high performing RDLs. | Continue reading
Fully self-driving cars will require AI that can learn as they drive. | Continue reading
Exponential increase is not sustainable. But where is it all going? | Continue reading
But that doesn't mean it's going to be mainstream anytime soon. | Continue reading
This new technical paper titled “AMD Prefetch Attacks through Power and Time” is from researchers at Graz University of Technology and CISPA Helmholtz Center for Information Security. Note, this is a prepublication paper for the USENIX Security Symposium in Boston in August 2022. … | Continue reading
A new research paper titled “ToSHI – Towards Secure Heterogeneous Integration: Security Risks, Threat Assessment, and Assurance” was published by researchers at the Florida Institute for Cybersecurity (FICS) Research, University of Florida. Abstract “The semiconductor industry is … | Continue reading
As tolerances tighten and density increases, these tools help ensure sufficient yield. | Continue reading
Steps are being taken to minimize problems, but they will take years to implement. | Continue reading
The industry reached an inflection point where analog is getting a fresh look, but digital will not cede ground readily. | Continue reading
AMD CTO Mark Papermaster talks about why heterogeneous architectures will be needed to achieve improvements in PPA. | Continue reading
Choosing components from a multi-vendor menu holds huge promise for reducing costs and time-to-market, but it's not as simple as it sounds. | Continue reading
New research paper titled “Hybrid silicon photonics DBR laser based on flip-chip integration of GaSb amplifiers and µm-scale SOI waveguides” by researchers at Tampere University (Finland). Abstract: “The development of integrated photonics experiences an unprecedented growth dyna … | Continue reading
New technology requires robust security, bandwidth, and electronic systems performance. | Continue reading
How to make IC design more accessible to more people. | Continue reading
Heterogeneous designs and AI/ML processing expose the limitations of existing methodologies and tools. | Continue reading
There are at least three architectural layers to processor design, each of which plays a significant role. | Continue reading
Why this technology could have a big impact on EV charging times. | Continue reading
Tools are coming, but advanced resists and masks need to keep pace. | Continue reading
Disaggregating SoCs into multiple chips introduces potential issues that may take years to show up. | Continue reading
Engineers are finding ways to effectively thermally dissipate heat from complex modules. | Continue reading
Increased transistor density and utilization are creating memory performance issues. | Continue reading
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns. | Continue reading
Lots of unknowns will persist for decades across multiple market segments. | Continue reading
Fire detection and simulation systems are growing more sophisticated and span larger distances. | Continue reading
AI can be used in several ways to help existing verification processes, but the biggest gain may come from rethinking some fundamentals. | Continue reading
Water sensors are getting smaller, lighter, cheaper, and much smarter. | Continue reading
How clock domain crossing verification helped land a spacecraft on a challenging site. | Continue reading
Brewer Science's CTO drills down into everything from purity and bonding to scaling and variation. | Continue reading
Smart software finds more EUV stochastic defects and missing vias, improving wafer yield. | Continue reading
Increased density, new materials, and longer lifetimes top the list for improving range and reducing cost. | Continue reading
Manufacturing 3D structures will require atomic-level control of what's removed and what stays on a wafer. | Continue reading
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips. | Continue reading
New vehicle designs will include many features determined by the end customer, and the list grows longer as vehicles become more autonomous. | Continue reading
A multi-core engine ECU using this migration technology can be applied in real-world automotive vehicles, leading to a significant improvement in performance. | Continue reading
A new system-level test for SoCs is gaining traction because it catches problems not detected at wafer probe and package test. | Continue reading
Driving to 10 defective parts-per-billion quality is all about finding, predicting nuanced behavior in ICs. | Continue reading
Interest in this particular ISA is expanding, but the growth of other open-source hardware is less certain. | Continue reading